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About VINATech

Vina R&D

Small Smart Device

VINATech develops MESS® (Micro Energy Storage System) for the backup power of small smart devices.

Project overview

Project name : Development of the surface installation type MESS
(Micro Energy Storage System) for the backup power of small smart devices
Participating organizations : VINATech, CAMTIC , Korea Institute of Carbon Convergence Technology Hanlim Patent & Law Office
Project period : July 1, 2014 ~ June 30, 2016 [24 months]
Project budget : 3 billion KRW (including 1.8 billion KRW in government contributions)

Project background and objectives

The production quantity of small smart devices in 2014 exceeded 1.7 billion sets, and is expected to reach 2.2 billion sets in 2017. On average, two MESS are required for each smart device (for memory backup and auxiliary power for instant pulse output). It is estimated that the MESS market will amount to 600 billion KRW (2200M devices/year * 2 MESS/device * 140 KRW/MESS).
The development goals of this project are to develop a MESS equipped with high temperature characteristics and price competitiveness, and enter the small smart device market.

Implementation organizations

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Organization	Role	Website
VINATech	-Product development and process optimization -Developing productivity enhancement technologies -Developing low cost process technologies	http://www.vina.co.kr
Korea Institute of Carbon Convergence Technology	-Developing a high-density sheet electrodes -Developing electrolytes with high temperature characteristics	http://www.kctech.re.kr
CAMTIC	Developing cell-type automated facilities	http://www.camtic.or.kr
Hanlim Patent & Law Office	-Analyzing the IP data, proposing avoidance design and developing -IP portfolio	http://www.iphl.co.kr

Development output

Bonding of metal and ceramic material is required to produce the MESS. To alleviate thermal shock applied to ceramic materials, KOVAR (Fe-Ni-Co alloy that has the coefficient of expansion similar to ceramic materials) is inserted between metal and ceramic material. In this case, the cost is composed of the plate price + KOVAR price + bonding process expenses.

If the tungsten-nickel layer forming process is applied, using the screen printing technique (the output of this project), the cost will be composed of the ceramic plate price + tungsten price + process expenses, which is about 35% cheaper than using KOVAR.